The Early-Stage Corrosion of Copper Materials in Chloride and Sulfide Solutions: Nanoscale Characterization and The Effect of Microstructure

The microstructures of copper (Cu) materials were investigated by electron backscatter diffraction, showing that electrodeposited (ED) Cu has a homogenous polycrystalline microstructure, while cold spray (CS) heterogeneous microstructure with varying grain size, pores, and interfacial splat regions. corrosion rate was examined potential (E CORR ) polarization resistance (R p measurements on specimens in solutions containing 0.1 M NaCl + 1 × 10 ?3 Na 2 S. Although the as sprayed CS-Cu least resistant, heat-treated similar to ED-Cu wrought (SKB-Cu). Electrochemical behaviours either potentiodynamic scan or potentiostatic at more positive > E for various experiment durations up 4 h, CS-Cu, SKB-Cu exhibited very behaviour showed erratic behavior consistent variable surface reactivity. Nanoscale scanning transmission microscopy analysis been performed cross-section an anodically-oxidized specimen, revealing two-layer film structure, mostly composed sulfide, minor diffusion sulfur local area boundary tip.